Customization: | Available |
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Product Type: | Foil |
Material: | CuNi |
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Chemical Composition and Main Property of Cu-Ni Low Resistance Alloy | |||||||
Properties\Grade | CuNi1 | CuNi2 | CuNi6 | CuNi8 | CuMn3 | CuNi10 | |
Main Chemical Composition | Ni | 1 | 2 | 6 | 8 | _ | 10 |
Mn | _ | _ | _ | _ | 3 | _ | |
Cu | Bal | Bal | Bal | Bal | Bal | Bal | |
Max Continuous Service Temperature(ºC) | 200 | 200 | 200 | 250 | 200 | 250 | |
Resisivity at 20ºC (μΩ·m) | 0.03 | 0.05 | 0.1 | 0.12 | 0.12 | 0.15 | |
Density(g/cm³) | 8.9 | 8.9 | 8.9 | 8.9 | 8.8 | 8.9 | |
Thermal Conductivity(α × 10-6ºC) | < 100 | < 120 | < 60 | < 57 | < 38 | < 50 | |
Tensile Strength(Mpa) | ≥ 210 | ≥ 220 | ≥ 250 | ≥ 270 | ≥ 290 | ≥ 290 | |
EMF vs Cu(μV/ºC)(0~1000ºC) | -8 | -12 | -12 | -22 | _ | -25 | |
Approximate Melting Point(ºC) | 1085 | 1090 | 1095 | 1097 | 1050 | 1100 | |
Micrographic Structure | austenite | austenite | austenite | austenite | austenite | austenite | |
Magnetic Property | non | non | non | non | non | non | |
Properties\Grade | CuNi14 | CuNi19 | CuNi23 | CuNi30 | CuNi34 | CuNi44 | |
Main Chemical Composition | Ni | 14 | 19 | 23 | 30 | 34 | 44 |
Mn | 0.3 | 0.5 | 0.5 | 1 | 1 | 1 | |
Cu | Bal | Bal | Bal | Bal | Bal | Bal | |
Max Continuous Service Temperature(ºC) | 300 | 300 | 300 | 350 | 350 | 400 | |
Resisivity at 20ºC (μΩ·m) | 0.2 | 0.25 | 0.3 | 0.35 | 0.4 | 0.49 | |
Density(g/cm³) | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | |
Thermal Conductivity(α × 10-6ºC) | < 30 | < 25 | < 16 | < 10 | < 0 | < -6 | |
Tensile Strength(Mpa) | ≥ 310 | ≥ 340 | ≥ 350 | ≥ 400 | ≥ 400 | ≥ 420 | |
EMF vs Cu(μV/ºC)(0~1000ºC) | -28 | -32 | -34 | -37 | -39 | -43 | |
Approximate Melting Point(ºC) | 1115 | 1135 | 1150 | 1170 | 1180 | 1280 | |
Micrographic Structure | austenite | austenite | austenite | austenite | austenite | austenite | |
Magnetic Property | non | non | non | non | non | non |