Tin Plated Copper Tape

Product Details
Customization: Available
Type: Copper Strips
Application: Resistors,Heaters
Manufacturer/Factory & Trading Company

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Number of Employees
15
Year of Establishment
2012-02-06
  • Tin Plated Copper Tape
  • Tin Plated Copper Tape
  • Tin Plated Copper Tape
  • Tin Plated Copper Tape
  • Tin Plated Copper Tape
  • Tin Plated Copper Tape
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Basic Info.

Model NO.
C1100
Material
C1100
Shape
Coil
Alloy
Alloy
Color
Copper
Standard
ASTM
Condition
Bright,Soft
Transport Package
Plastic Film, Weave Bag, Pallet
Specification
Thickness: 0.2~10mm
Trademark
ualloy
Origin
China
HS Code
7409111000
Production Capacity
100tons/Month

Product Description

High Quality Cu-ETP  TIN Plated Pure Copper Strip

It can be used for all kinds of deep drawing and bending force parts, such as pin, rivet, washer, nut, pipe, pressure gauge, screen, radiator parts, etc. It has good mechanical properties, good plastic in thermal state, plastic in cold state, good cutting ability, easy fiber welding , corrosion resistance. It is widely used as an ordinary brass variety.


Tin Plated Copper Tape

 

 

 

 

 

 

 

The specification of Copper foil

 

Item

 

 

Double side polished

Single side polished

Double side polished

Single side polished

Standard Thick

um

8

9

12

9

7

8

9

12

8

9

Basic weight

g/m2

70-75

85-90

100-105

85-90

62-65

70-75

85-90

100-105

70-75

85-95

Test thickness

um

/

/

/

/

≤8

≤9

≤10

≤13

≤10

≤11

Cu

%

≥99.8

≥99.8

≥99.8

≥99.8

≥99.8

≥99.8

≥99.8

≥99.8

≥99.8

≥99.8

TS

Room

≥294

≥294

≥294

≥245

≥294

≥294

≥294

≥294

≥245

≥245

180ºC

≥196

≥196

≥196

≥147

≥196

≥196

≥196

≥196

≥147

≥147

Ductility

Room

≥5

≥5

≥5

≥2.5

≥5

≥5

≥5

≥5

≥2.5

≥2.5

180ºC

≥3

≥3

≥3

≥2

≥3

≥3

≥3

≥3

≥2

≥2

surface roughness

 

Polished side

≤3

≤3

≤3

≤3

≤3

≤3

≤3

≤3

≤3

≤3

Coarse side

≤0.3

≤0.3

≤0.3

≤0.5

≤0.3

≤0.3

≤0.3

≤0.3

≤0.5

≤0.5

wettability

mN/m

≥32

≥32

≥32

≥32

≥32

≥32

≥32

≥32

≥32

≥32

high temperature oxidation resistance

160ºC/10 min copper foil surface should be no oxidation discoloration

180ºC/10 min copper foil surface should be no oxidation discoloration

 

 

 

 

 

 

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